The ATC 1500 sputter deposition system, by AJA International, has the capability to co-sputter conductive and insulating materials on substrates up to 100mm in diameter. In addition to Ar sputtering, N2 and O2 are also available for use in reactive-ion sputtering. The UTD tool is equipped with 2 RF and 2 DC magnetron sources with in-situ tilt capability to optimize film uniformity. The substrate is capable of heating to 800C while under rotation as well as exposure to reactive gasses and RF bias. Software for control of the various source shutters is also available for automated film stack deposition.



User Manual

Process Data


Control Charts



PM Details




Updated: 2011-03-30