TECHNICS RIE
The Technics Reactive Ion Etcher creates a directional high energy gas plasma to etch materials.
Oxygen is used to remove carbon based materials and CF4 is used to remove silicon based materials.
Updated: 2008-06-18
The Technics Reactive Ion Etcher creates a directional high energy gas plasma to etch materials.
Oxygen is used to remove carbon based materials and CF4 is used to remove silicon based materials.
Updated: 2008-06-18
