UNAXIS 790 PECVD

The Plasma Enhanced Chemical Vapor Deposition Unaxis 790 PECVD tool is configured to deposit high-quality silicon dioxide and silicon nitride, and amorphous silicon films to temperatures from 100 C to 300 C. The tool was donated to UTD in May 2004 by the Mykrolis Corporation.

 

 

User Manual

Process Data

Low-Stress Nitride

a-Silicon

Oxide

Control Charts

Low-Stress Nitride

a-Silicon

Oxide

 

 

 

Updated: 2008-06-26