Material Data Safety Sheets
The list below provides information on materials. chemicals and gasses that may be utilized in the cleanroom. Always consult the manufacturer's MSDS prior to utilizing any chemical.
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Acids and Etchants
- Acetic Acid
- Aqua regia (Platinum Etch)
- Buffered Oxide Etch (BOE - Ammonium Fluoride + HF Mixtures)
- BOE 20:1
- BOE 7:1
- Chrome Etch (Cerric ammonium nitrate + Perchloric Acid)
- Chrome Etch - CR 7S
- Chrome Etch - CR 9S
- Hydrochloric Acid (HCl)
- Hydrofluoric Acid (HF)
- Hydrofluoric Acid 1% (Premix HF and water)
- Hydrofluoric Acid 10% (Premix HF and water)
- Nanostrip Etch (Sulfuric Acid + Hydrogen Peroxide)
- Nitric Acid
- Perchloric Acid
- Phosphoric Acid
- Sulfuric Acid (H2SO4)
- Vapox III (Ammonium Bifluoride BOE)
Caustics
Cryogenic Fluids
Developers
- AZ 300 MIF Developer
- AZ 400 K Developer
- Lift-off Layer 2000
- MF 26A Developer
- MF 319 Developer
- MF 320 Developer
- MF 702 Developer
- PMGI 101 Developer
- SU-8 Developer
Gasses
- Argon (Ar)
- Ammonia, Anhydrous (NH3)
- Boron Trichloride (BCl3)
- Carbon Tetrafluoride ("Halocarbon 14" CF4)
- Carbon Tetrafluoride and Oxygen Mixture
- Chlorine (Cl2)
- Compressed Air
- Deuterium (D2)
- Deuterated Forming Gas (N2:D2) (see Forming Gas)
- Dichlorosilane (SiH2Cl2)
- Forming Gas (N2:H2; >5.7% H2 - Flammable)
- Forming Gas (N2:H2; <5.7% H2 - Nonflammable)
- Helium (He)
- Hydrogen (H2)
- Methane (CH4)
- Nitrogen (N2)
- Nitrous Oxide (N2O)
- Nitric Oxide (NO)
- Octaflurocyclobutane (C4F8)
- Oxygen (O2)
- Phosphine (PH3)
- Sulfur Hexafluoride (SF6)
- Silane (SiH4)
- Siline and inert (N2, He or Ar) mixture
- Silane and Helium Nonflammable mixture
- Silane and Nitrogen Nonflammable mixture
- Silane and Nitrogen Flammable mixture
- Trifluromethane ("Halocarbon 23" CHF3)
Oxidizers
Metals
- Aluminum (Al)
- Chromium (Cr)
- Gold (Au)
- Hafnium (Hf)
- Lanthanum (La)
- Molybdenum (Mo)
- Nickel (Ni)
- Niobium (Nb)
- Platinum (Pt)
- Tantalum (Ta)
- Titanium (Ti)
- Tungsten (W)
Nitrides
Oxides
- Alumina (Al2O3)
- Hafnium Oxide (HfO2)
- Hafnium Silicate (HfSiO4)
- Indium Tin Oxide (ITO)
- Lanthanum Aluminate (LaAlO3)
- Ruthenium Oxide (RuO2)
- Silica (SiO2)
- Tantalum Oxide (Ta2O5)
- Vanadium Oxide (V2O5)
- Zirconium Oxide (ZrO2)
- Zirconium Silicate (ZrSiO4)
Photoresists
Semiconductors
Silicides
- Hafnium Silicide (HfSi2)
- Molybdenum Silicide (MoSi2)
- Tantalum Silicide (TaSi2)
- Titanium Silicide (TiSi2)
- Tungsten Silicide (WSi2)
Solvents
- Acetone ((CH3)2CO)
- Anisole (C6H5OCH3)
- Chlorobenzene (C6H5Cl)
- Ethanol
- Isopropanol ((CH3)2 CHOH)
- Methanol (CH3OH)
- Methyl Isobutyl Ketone
- Trichloroethylene (C2HCl3)
- Toluene (C6H5-CH3)
- Triethylene Glycol (C6H14O4)
- Xylenes (C6H4(CH3)2)
Updated: 2008-03-28
