KULICKE SOFFA CHISEL WIRE BONDER

K&S 4123 wedge bonder is used to bond 25 micron gold, aluminum or copper wires to metallized pads as small as 30 microns using a thermo-compression process known as chisel bonding.

This differs from ball bonding in allowing lower temperatures and closer pad spacing to be used.

User Manual coming soon...

 

Updated: 2008-04-24