KULICKE SOFFA CHISEL WIRE BONDER
K&S 4123 wedge bonder is used to bond 25 micron gold, aluminum or copper wires to metallized pads as small as 30 microns using a thermo-compression process known as chisel bonding.
This differs from ball bonding in allowing lower temperatures and closer pad spacing to be used.
User Manual coming soon...
Updated: 2008-04-24
