KULICKE SOFFA BALL WIRE BONDER

K&S 4124 ball bonder is used to bond 25 micron gold, aluminum or copper wires to metalized pads as small as 50 microns using a thermo-compression process known as ball bonding. The system can be configured for wires as small as 8 microns.

The wires typically are used  to link a fabricated microstructure to a robust connector which allows connection to conventional test equipment.

 

User Manual coming soon...

 

 

Updated: 2008-04-24