TOHO FLX2320 THIN FILM STRESS MEASUREMENT

The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well known mathematical relation is then used to calculate the stress of the thin film.

 

User Manual

 

Updated: 2008-07-28