The Samco Deep UV cleaner is a system using 185 nM and 254 nM energy with Oxygen or Ozone to remove compounds from the surface of a substrate. This can result in an atomically clean surface. Typically, most of the compounds (photoresist, etchant masks) will be removed with a chemical stripper. The DUV cleaner is only used for the last few percent of compound left.
The Samco has many operational variables, heat, time, oxygen, ozone, DUV light. All of these may be combined or run singly.