The March PX250, is a highly versatile plasma etcher. It will produce three
distinctly different plasma conditions: 1) Standard plasma etch, 2) Reactive Ion Etch,
and 3) Downstream Plasma Etch. It achieves this via a system of removable
and reversible electrode shelves whereby the substrates to be etched can be
placed on a grounded or powered or neutral shelf, thus producing the various
plasma etch conditions. We have initially assigned this tool for Oxygen plasma
ashing of organic films – mainly photoresist.