The Plasma-Therm dielectric etch and DSE (Deep Silicon
Etch) tool is configured for etching films using fluorine based chemistries.
Presently, SF6, CHF3, C4F8,
and O2, process gases are installed on the tool. The tool is equipped with a vacuum load-lock
to prevent potentially toxic etch by-products from venting to the Cleanroom during sample load and unload.
December, 2011, Gordon Pollack, University of Texas at Dallas