The Plasma-Therm plasma ICP etcher is configured for etching metallic films using chlorine based chemistries.
Presently, Cl2, BCl3, O2, and Ar are installed on the tool. The tool is equipped with a vacuum load-lock
to prevent potentially toxic etch by-products from venting to the Cleanroom during sample load and unload.
December, 2011, Gordon Pollack, University of Texas at Dallas