The University of Texas at Dallas

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Plasma-Therm ICP Etcher

The Plasma-Therm plasma ICP etcher is configured for etching metallic films using chlorine based chemistries. Presently, Cl2, BCl3, O2, and Ar are installed on the tool. The tool is equipped with a vacuum load-lock to prevent potentially toxic etch by-products from venting to the Cleanroom during sample load and unload.

December, 2011, Gordon Pollack, University of Texas at Dallas