The University of Texas at Dallas

Natural Science and Engineering Research Laboratory

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NSERL Cleanroom Tools

Process Data


Tube 1: Silicon Nitride

Tube 1: Low-Stress Nitride

Tube 2: Polysilicon

Tube 3: N+ Polysilicon

Tube 3: P+ Polsilicon

Tube 4: Low-Temp-Oxide

Control Charts


Tube 1: Silicon Nitride

Tube 1: Low-Stress Nitride

Tube 2: Polysilicon

Tube 4: Low-Temp-Oxide

Tystar LPCVD Furnace

The Tystar Low-Pressure-Chemical-Vapor-Deposition (LPCVD) tool consists of four horizontal sub-atmospheric furnace tubes that can process up to 6" diameter silicon wafers. The furnaces are fully computer controlled and are configured to deposit doped and undoped polysilicon, silicon dioxide, and silicon nitride films. The tool is capable of depositing films with wafer-to-wafer and within-wafer uniformity of better than 5%. This tool was donated to UTD by the Von Ehr Foundation.

March, 2013, Gordon Pollack, University of Texas at Dallas