02/24: Paper titled “MENDNet: Just-in-time Fault Detection and Mitigation in AI Systems with Uncertainty Quantification and Multi-Exit Networks” has been accepted for publication at DAC 2024
0224: Paper titled “Graph Learning-based Fault Criticality Analysis for Enhancing Functional Safety of EE Systems” has been accepted for publication at DAC 2024
02/24: Paper titled “NSPG: Natural language Processing-based Security Property Generator for Hardware Security Assurance” has been accepted for publication at DAC 2024
12/23: Paper titled “Analyzing and Mitigating Circuit Aging Effects in Deep Learning Accelerators” has been accepted for publication at IEEE VLSI Test Symposium 2024.
11/23: Congrats Xingyu for defending your PhD thesis. Congrats Dr. Meng. Xingyu is the third PhD graduate from TIES lab.
11/23: Paper titled “Hardware-based Detection of Malicious Firmware Modification in Microgrids” has been accepted for publication at International Conference on VLSI Design
10/23: Paper titled “Real-Time Artificial Intelligence Enhanced Defect Engineering in CeO2 Nanostructures” has been accepted for publication at AVS Journal of Vacuum Science and Technology A.
09/23: Congratulations Ayush for defending your PhD thesis. Congrats Dr. Arunachalam. Ayush is the second PhD graduate from TIES lab. He will be joining NXP semiconductors in Austin, TX.
07/23: Paper titled “Enhanced ML-based Approach for Functional Safety Improvement in Automotive AMS Circuits” has been accepted for publication at IEEE International Test Conference
05/23: Paper titled “Application Profiling Using Register-Instruction Hardware Performance Counters” has been accepted for publication at ISVLSI 2023
04/23: Paper titled “Feature- and Signal Selection-aware FuSa Violation Detection in Automotive AMS Circuits” has been accepted for publication at TECHCON 2023
04/23: Paper titled “Improving Fault Injection-based Functional Safety Evaluation using Machine Learning” has been accepted for publication at TECHCON 2023