Your browser does not support inline frames or is currently configured not to display inline frames.
Nanoscale Strains in Si CMOS
µ Strained-Si CMOS characterization technology
µ Experimental procedure
Ø Site-specific sample preparation by FIB and thickness effect on CBED
Ø Choice of Zone Axis
Ø CBED pattern simulation and strain calculation
µ Analysis of Strain-engineered Si CMOS
Ø Si PMOS with SiGe in S/D
Ø One-dimensional strain map
Ø Si NMOS with SiN capping
Ø STI w/wo Trench Filling
Ø Process-induced strain
Ø Strain relaxation in Si1-xGex/Si