Welcome to Lawrence J. Overzet's Web Pages

UNDER RECONSTRUCTION (slowly...)   Updated: 10/97

Advantages of modulated-power plasma processing.

Advantages of modulated-power plasma processing.

  • “Dust” particle formation can be diminished.
    • Y. Watanabe et. al. Appl. Phys. Lett. 53, 1263-5 (1988). Modulation caused “… a drastic suppression of powder concentration in the discharge space.”
    • C. Courteille et. al. Plasma Sources Sci. Technol. 5, 210-5 (1996). The data “… suggest that negative ions are involved in powder formation for these plasma conditions in which particles appear slowly, many seconds after plasma ignition.”
  • Etch/deposition rate can be maintained despite lower power.
    • R. Boswell and D. Henry, Appl. Phys. Lett. 47, 1095-7 (1985). SF6 Si etching “… for pulse durations less than 10 ms the etch rate has increased to the continuous discharge value, although the duty cycle has been kept constant at 20%.”
    • C. Charles et. al. Appl. Phys. Lett. 67, 40-42 (1995). For SiO2 “… as the pulse frequency increases from 0.1 to 100Hz, the deposition rate increases and equals that for a continuous plasma.”

Previous slide Next slide Back to the first slide View Graphic Version